Ecological Means of Concerted Development Between High-tech Park and City: A Case of Shenzhen Silicon Peak Software Park

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  • Institute of Geographic Sciences and Natural Resources Research, CAS, Beijing 100101, China

Received date: 2002-08-06

  Revised date: 2002-12-30

  Online published: 2003-05-25

Supported by

Knowledge Innovation Project of CAS, No.KZCX2-SW-318-03; No.KZCX1-08; No.KZCX1-09-04

Abstract

High-tech park is a new industrial spatial form, which is different from traditional industrial form. These parks have particular sites, generally settled in the suburbs of the city to avoid industrialized area and to attach the urbanized area cheek by jowl. High-tech employees and knowledge industries get together in those parks. Their innovation space is limited, however, their innovation ability is strong. Their favourable eco-environment is useful to waken personnel's inspiration. Therefore, the dynamic concordated relationships between high-tech park and the city are often going on. Population, resource, ecology, environment, economy and society constitute six aspects of relationships between high-tech park and the city. According to people's satisfactory degree for any aspect, this paper constructs an index to measure the relationship. In order to develop the high-tech park harmoniously, this paper takes Shenzhen silicon peak software park as an example, provides four means to regulate it, that is, based on GIS, making systems analysis of park natural and ecological condition; through layout, reasonably distributing the park function zones and deciding its spatial structure; through landscape design, strengthening the sightseeing effect and improving its life amenity; and through the market economy means, upgrading the area economic, ecological and social benefits.

Cite this article

FANG Chuanglin, HUANG Jinchuan . Ecological Means of Concerted Development Between High-tech Park and City: A Case of Shenzhen Silicon Peak Software Park[J]. Acta Geographica Sinica, 2003 , 58(3) : 390 -397 . DOI: 10.11821/xb200303008

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